PhD on Efficient multi-band InP and CMOS mm-wave front-ends

Functieomschrijving

Outline of the FNS-6G program:

The FNS innovations are developed in four program lines: (1) intelligent components, developing software antennas for the new high (mm-wave and THz) frequencies in 6G; (2) intelligent networks, developing AI-driven software for 6G radio and core networks; (3) leading applications, developing new 6G applications in mobility, energy, health and other sectors that create value through new set-ups of the sector value chains; (4) ecosystem strengthening, integrating the FNS innovations in the national 6G testbed, stimulating start-ups and SMEs, developing and executing the human capital agenda and ensuring policy alignment. The consortium currently consists of a mix of 60 large and small telecom, semiconductor and ICT companies, universities and public bodies.

The PhD position “Efficient multi-band  InP mm-wave front-ends  including integration possibilities with CMOS”:

So far wireless communications have experienced explosive growth. In last 30 years, through five generations of wireless systems, the data rates have been increased for couple of orders of magnitude. In addition, the wireless communications provide very broad content and support various applications. The 6G networks present next step in the development of wireless communications. The aim of 6G networks will be to improve data rates, reduce latency, contribute significantly to safety and finally combine communication and sensing systems.

In order to address these challenges the operating frequencies need to be increased to mm-wave portion of the frequency spectrum in order to allow usage of wide signal bandwidths. In addition, the devices will be required to operate at multiple frequency bands as well as to support different operating frequencies.

Using mm-wave carrier frequencies brings benefit in terms of signal bandwidth.  Consequently, data rates in communication systems and resolution in sensing devices are improved. Nevertheless, it imposes a challenge in meeting the link budget requirements due to a large path loss. Conventional transmitter and receiver architectures designed and implemented in CMOS technologies will not be able to meet the link budget specifications. They provide limited gain, noise and output power capabilities at mm-wave frequencies. In addition, when using these architectures in the beamforming and MIMO solutions, they run into thermal and integration problems. An alternative is to use Indium Phosphide (InP) technology, which significantly improves performance of mm-wave circuits. Consequently, CMOS and InP chips need to be efficiently combined/integrated in order to maximize the integration level. This is essential for  beamforming and MIMO solutions, particularly in the frame of multi-band operation. 

The objective of this PhD project is the research into mm-wave transceiver architectures having in mind optimal distribution of building blocks between CMOS and InP chips as well as multi-band operation. Further, investigation has to be done into topologies of the mm-wave building blocks implemented in InP technology (power amplifiers, low-noise amplifiers, mixers) in order to maximize efficiency, minimize occupied chip area, enable multi-band operation and improve integration possibilities with CMOS. The options for integration need to be carefully investigated. The most promising one need to be selected from cost, robustness and complexity perspective. Finally, the scope of the prototype needs to be defined in such way that the proof of concept is demonstrated. The prototyping needs to include InP and CMOS chips, as well as integrated solution. The characterization of the prototype needs to be performed, and results have to be compared with simulations.

The main responsibilities of the PhD student will be:

• Conduct in-depth research on mm-wave transceiver architectures taking into account integration between CMOS and InP chips as well as multi-band operation. Propose the most promising architecture.
• Conduct in-depth research on integration technologies/solutions between CMOS and InP chips. Propose optimal integration technology/solution from cost, robustness and complexity perspective.
• Conduct in-depth research into mm-wave InP building blocks (power amplifiers, low-noise amplifiers, mixers). Propose the most promising topologies from efficiency, chip area and multi-band operation perspective.
• Define the prototype to prove the concept, design, fabricate and characterize the prototype.
• Conduct theoretical studies and simulations, verify/compare by characterization and testing.
• Contribute to the scientific community knowledge through high-quality publications.
• Prepare and defend the PhD thesis, which summarizes the results of the research.

Functie-eisen

• MSc degree in Electrical Engineering.
• Strong background in electronic circuits design.
• Experience with tools for design/simulation/implementation of integrated circuit design as Cadence, Virtuoso, Spectre, ADS.
• Being familiar with EM software tools as EMX, Momentum for design of on-chip passive structures and CST and HFSS for package design and evaluation of integration solutions
• Excellent analytical and problem-solving skills.
• Effective communication and collaboration skills.

We make our selection based on the following general requirements:

• Formal requirements regarding prior education: you should have earned an MSc degree at a recognized institute for higher education.
• Excellence: your Grade-Point-Average should be above 8 (10). Also your MSc thesis should have received a grade above 8 (10).
• English: you should be able to communicate well in English (written and oral). Provide TOEFL/IELTS scores if available.
• Originality: your MSc thesis or later work (publications) should reflect some original ideas. Critical and independent thinking is very important.
• Team player: you should be able to work well in a team of other project members.

Arbeidsvoorwaarden

A meaningful job in a dynamic and ambitious university, in an interdisciplinary setting and within an international network. You will work on a beautiful, green campus within walking distance of the central train station. In addition, we offer you:

• Full-time employment for four years, with an intermediate evaluation (go/no-go) after nine months. You will spend 10% of your employment on teaching tasks.
• Salary and benefits (such as a pension scheme, paid pregnancy and maternity leave, partially paid parental leave) in accordance with the Collective Labour Agreement for Dutch Universities, scale P (min. €2,901 max. €3,707).
• A year-end bonus of 8.3% and annual vacation pay of 8%.
• High-quality training programs and other support to grow into a self-aware, autonomous scientific researcher. At TU/e we challenge you to take charge of your own learning process.
• An excellent technical infrastructure, on-campus children's day care and sports facilities.
• An allowance for commuting, working from home and internet costs.
• A Staff Immigration Team and a tax compensation scheme (the 30% facility) for international candidates. 

Informatie en sollicitatie

About us

Eindhoven University of Technology is an internationally top-ranking university in the Netherlands that combines scientific curiosity with a hands-on attitude. Our spirit of collaboration translates into an open culture and a top-five position in collaborating with advanced industries. Fundamental knowledge enables us to design solutions for the highly complex problems of today and tomorrow. 

Curious to hear more about what it’s like as a PhD candidate at TU/e? Please view the video.

Information

Do you recognize yourself in this profile and would you like to know more? Please contact
dr. Vojkan Vidojkovic, v.vidojkovic@tue.nl or dr. Georgi Radulov, g.radulov@tue.nl.

Visit our website for more information about the application process or the conditions of employment. You can also contact

Are you inspired and would like to know more about working at TU/e? Please visit our career page.

Application

We invite you to submit a complete application by using the apply button.
The application should include a:

• Cover letter in which you describe your motivation and qualifications for the position.
• Curriculum vitae, including a list of your publications and the contact information of three references.

We look forward to receiving your application and will screen it as soon as possible. The vacancy will remain open until the position is filled.